TECHNOLOGY

Wireless power transfer by volume conduction

Wireless power transfer (WPT) methods are frequently used as an alternative to electrochemical batteries to energize electronic implants. However, methods based on inductive coupling or ultrasounds have obtained high miniaturization levels at the expense of link efficiency, penetration depth or functionality.

In the last years we have proposed and demonstrated a WPT method that avoids the use of bulky components within the implant, resulting in thin, flexible and elongated devices that can be deployed by injection. The implants are powered and controlled by applying — through external electrodes — high frequency current bursts that flow through the tissues by volume conduction6. The currents are picked-up by the implant’s electrodes (located at the ends of the elongated body) and are rectified for powering and bidirectional communications. This allows the integration of the electronics in an application-specific integrated circuit (ASIC).

Research results before FORESEE

Within the eAXON project, we developed tubular addressable microstimulators for neuroprosthetics. The implants included a hermetic capsule that housed an integrated circuit7 and resulted in an overall diameter of 0.97 mm. The devices were successfully tested in anesthetized rabbits and sheep.

We have successfully validated in humans that the applied high frequency current bursts complying with safety standards are innocuous, imperceptible, and safe8, and can be used to power and bidirectionally communicate with implantable devices that can perform electrical stimulation and EMG sensing9


The use of volume conduction in FORESEE

The FORESEE platform is composed of:

Our technology could revolutionize this field, as the microsensors: 

Our microsensing technology is protected by one granted patent (EP21382183.8) and one patent application (EP19382757.3). From its conception, it has been developed according to regulatory guidelines.

References

7 J Neural Eng. 2022 Sep 14;19(5). Link

8 IEEE Trans Biomed Eng. 2023 Feb;70(2):659-670. Link

9 J Neuroeng Rehabil. 2024 Jan 3;21(1):4. Link